Enclosure and method of manufacturing the same

ABSTRACT

A core layer is formed by bonding a plurality of wooden plates together by using an adhesive. The core layer is cut into a predetermined shape having notches. The core layer is placed on a die of a pressing machine by being positioned by using the notches and pins placed on the die. The core layer is press molded to firmly hold the pin by the outer edge of the notch and to harden the adhesive.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a division of U.S. Ser. No. 13/887,465, filed May 6,2013, which application is a continuation of International PatentApplication No. PCT/JP2010/072362 filed Dec. 13, 2010 and designated theU.S., the entire contents of which are incorporated herein by reference.

FIELD

The embodiments discussed herein are related to an enclosure using woodand a method of manufacturing the same.

BACKGROUND

An enclosure of an electronic device such as a notebook computer or amobile phone is generally made of metal or plastic, while an enclosurewith its surface having a woodgrain pattern printed thereon is sometimesused because many users like unique texture of wood. However, when awoodgrain pattern is simply printed, the texture of wood is not fullyreproduced. Hence, there is proposed use of wood for an enclosure of anelectronic device.

Patent Document 1: Japanese Laid-open Patent Publication No.2005-353748.

Patent Document 2: Japanese Laid-open Patent Publication No. 10-31533.

However, it is difficult to manufacture an enclosure having curvedsurfaces with good accuracy while keeping the texture of wood.

SUMMARY

According to a technical aspect of the disclosure, a method ofmanufacturing an enclosure, the method includes: forming a core layer bybonding a plurality of wooden plates together by using an adhesive;cutting the core layer to have a shape having a notch; placing the corelayer on a die of a pressing machine while positioning the core layer byusing the notch and a pin placed on the die; and press molding the corelayer to firmly hold the pin by an outer edge of the notch and to hardenthe adhesive.

The object and advantages of the embodiments will be realized andattained by means of the elements and combinations particularly pointedout in the claims.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory and arenot restrictive of the embodiments, as claimed.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a diagram for explaining a method of manufacturing anenclosure according to a first embodiment (No. 1);

FIG. 2 is a diagram for explaining the method of manufacturing anenclosure according to the first embodiment (No. 2);

FIGS. 3A to 3C are diagrams for explaining the method of manufacturingan enclosure according to the first embodiment (No. 3);

FIG. 4 is a diagram for explaining the method of manufacturing anenclosure according to the first embodiment (No. 4);

FIGS. 5A and 5B are diagrams for explaining the method of manufacturingan enclosure according to the first embodiment (No. 5);

FIG. 6 is a diagram for explaining the method of manufacturing anenclosure according to the first embodiment (No. 6);

FIGS. 7A to 7C are diagrams for explaining the method of manufacturingan enclosure according to the first embodiment (No. 7);

FIG. 8 is a diagram for explaining the method of manufacturing anenclosure according to the first embodiment (No. 8);

FIG. 9 is a diagram for explaining the method of manufacturing anenclosure according to the first embodiment (No. 9);

FIGS. 10A and 10B are diagrams for explaining the method ofmanufacturing an enclosure according to the first embodiment (No. 10);

FIG. 11 is a diagram for explaining the method of manufacturing anenclosure according to the first embodiment (No. 11);

FIG. 12 is a diagram for explaining the method of manufacturing anenclosure according to the first embodiment (No. 12);

FIG. 13 is a diagram for explaining the method of manufacturing anenclosure according to the first embodiment (No. 13);

FIG. 14 is a diagram for explaining the method of manufacturing anenclosure according to the first embodiment (No. 14);

FIGS. 15A to 15C are diagrams for explaining the method of manufacturingan enclosure according to the first embodiment (No. 15);

FIG. 16 is a schematic diagram illustrating a state where an electroniccomponent is installed in an enclosure;

FIGS. 17A and 17B are diagrams for explaining a method of manufacturingan enclosure according to a second embodiment;

FIG. 18 is a diagram illustrating a state after the panel is bonded to acore layer;

FIG. 19 is a diagram for explaining a method of manufacturing anenclosure according to a third embodiment (No. 1);

FIG. 20 is a diagram for explaining the method of manufacturing anenclosure according to the third embodiment (No. 2);

FIGS. 21A and 21B are diagrams for explaining the method ofmanufacturing an enclosure according to the third embodiment (No. 3);

FIG. 22 is a diagram for explaining the method of manufacturing anenclosure according to the third embodiment (No. 4);

FIG. 23 is a diagram for explaining the method of manufacturing anenclosure according to the third embodiment (No. 5);

FIG. 24 is a diagram for explaining the method of manufacturing anenclosure according to the third embodiment (No. 6);

FIG. 25 is a diagram for explaining the method of manufacturing anenclosure according to the third embodiment (No. 7); and

FIGS. 26A to 26C are diagrams for explaining the method of manufacturingan enclosure according to the third embodiment (No. 8).

DESCRIPTION OF EMBODIMENTS

Hereinbelow, before describing the embodiments, a description is givenof a prelude for easy understanding of embodiments.

A conceivable method of manufacturing a wooden enclosure isthree-dimensional processing by hollowing a thick plate. However, thismethod leads to a lot of waste materials and has a strength problem.Hence, use of plywood is conceivable for manufacturing the enclosure.

The use of plywood may make it possible to use: aesthetically pleasingwood without a joint or a worm-bore for a surface of the enclosure; andreasonable and highly processable wood for the inside thereof. Inaddition, stacking a plurality of thin plates may make it possible toensure sufficient strength.

For manufacturing an enclosure having curved surfaces by using theplywood, the following method is conceivable. Specifically, the plywoodis made flexible by being exposed to high-temperature steam, and then ispress molded by using a mold having a certain shape. However,manufacturing an enclosure of a notebook computer or a mobile phoneoften uses sharp bending or deep drawing, and thus the aforementionedmethod might cause a crack or a crease in a bent portion. Moreover, whenan unnecessary portion is cut down after the press molding, chipping islikely to occur, and thus the yield is lowered.

Further, for fixing a component such as a wiring board, fixing memberssuch as bosses and spacers are attached to the enclosure of theelectronic device. Although use of an adhesive is conceivable forattaching the fixing members to the enclosure, this case has steps ofapplying the adhesive, positioning the fixing members, hardening theadhesive, and the like, thus having a problem of increasing the numberof steps. Although boring the enclosure and using screws or the like arealso conceivable for fixing the fixing members, this case leads toexposure of the screws or the like from a surface of the enclosure, thushaving a design problem.

From the above, there is a demand for a method of manufacturing anenclosure having high processing accuracy, an aesthetically pleasingappearance and favorable yield.

Hereinbelow, descriptions are given of the embodiments.

First Embodiment

FIGS. 1 to 15 are diagrams for explaining a method of manufacturing anenclosure according to a first embodiment.

Firstly, as in a cross-sectional diagram of FIG. 1, a plurality of thinwooden plates 11 are bonded together with a thermosetting adhesive 12 toform a core layer 13. At this time, the thin plates 11 are bondedtogether by using adhesive force of the thermosetting adhesive 12 beforehardening, and the thermosetting adhesive 12 is not hardened yet. Thethin plates 11 are each set to have a thickness of approximately 0.5 mmto 1.0 mm, for example, and are preferably stacked on one another withthe woodgrain patterns crossing each other layer by layer for ensuringthe strength. In addition, the thin plates 11 are preferably madeflame-retardant by being impregnated with a flame retardant in advance.

The thin plates 11 forming the core layer 13 are not desired to beaesthetically pleasing, and thus are allowed to have joints, worm-bores,and the like therein to some extent. In addition, since one layer may beformed by arranging the plurality of the thin plates 11 in a horizontaldirection as illustrated in FIG. 1, thin plates formed from thinningsand thus having small widths may be used as the thin plates 11.

Next, as in a plan diagram of FIG. 2, the core layer 13 is cut into apredetermined shape. The cutting may be performed by punching or byusing a band saw or the like. At this time, notches 13 a are provided inportions to be largely bent in press molding to be described later. Itis important that the notches 13 a disappear by being closed at the timeof the press molding. Portions for the notches 13 a are determined inaccordance with the shape to be obtained after the press molding.

Next, a frame 14 to be attached to end portions of the core layer 13 isprepared. FIG. 3A is a plan diagram of the frame 14, FIG. 3B is a sidediagram of the frame 14, viewed in a direction illustrated by an arrow Ain FIG. 3A, and FIG. 3C is a cross-sectional diagram taken along the I-Iline of FIG. 3B.

As illustrated in FIGS. 3B and 3C, the frame 14 includes: a firstsurface 14 a facing end faces of the core layer 13; and a second surface14 b and a third surface 14 c which sandwich the end portions of thecore layer 13 on the front and back sides of the core layer 13. Inaddition, cylindrical bosses 15 are arranged on the frame 14 atpredetermined positions where a central axis of each boss 15 is parallelto the second surface 14 b and orthogonal to a direction in which theframe 14 extends.

The frame 14 is preferably made of a material having a higher strengththan that of the core layer 13. In this embodiment, the frame 14 and thebosses 15 are integrally formed of a resin. The frame 14 and the bosses15 may also be formed of a metal such as aluminum. Alternatively, theframe 14 and the bosses 15 may be formed separately, and then may beintegrated into one by welding or the like.

Next, as in FIG. 4, the frame 14 is attached to the end portions of thecore layer 13 (including end portions of the notches 13 a) in such amanner as to surround the core layer 13. Thereafter, in preprocessing ofthe press molding, the core layer 13 is made flexible by being exposedto steam for approximately 30 seconds, for example.

Next, as in a cross-sectional diagram of FIG. 5A, the core layer 13 isplaced on a lower die 21 of a pressing machine. In this case, holes areprovided in advance in corner portions of the lower die 21 (portionswhere the core layer 13 are largely bent), and pins 16 serving asspacers are inserted into the holes. Then, as in a plan diagram of FIG.5B, the core layer 13 is placed on the lower die 21 by using the pins 16as guides. In other words, the core layer 13 is placed on the lower die21 in such a manner that the pins 16 are located in the corner portionsof the notches 13 a of the core layer 13. This may make it possible toaccurately position and place the core layer 13 on the lower die 21.Note that the pins 16 are preferably short enough not to protrude fromthe core layer 13. Reference numeral 22 in FIG. 5A denotes an upper diefor press molding a core layer.

Next, as in FIG. 6, the upper die 22 is lowered, so that the lower die21 and the upper die 22 sandwich the core layer 13. Then, a pressure anda heat are applied thereto to press mold (bend) the core layer 13 into apredetermined shape corresponding to the dies 21 and 22. This makes thecore layer 13 have a three-dimensional shape as in FIGS. 7A to 7C. FIG.7A is a top diagram of the core layer 13 (a press molded component)molded by the press molding, FIG. 7B is a bottom diagram thereof, andFIG. 7C is a side diagram thereof.

In the press molding, the notches 13 a are gradually closed as the corelayer 13 is gradually bent, and finally the notches 13 a disappear. Inaddition, the pins 16 are fixed by being held by the frame 14. Further,since the adhesive 12 among the thin plates 11 has not hardened at aninitial stage of the press molding, the thin plates 11 are displacedfrom one another when being bent. Thereafter, the adhesive 12 hardensdue to heat from the dies 21 and 22, so that the shape of the core layer13 is fixed. Thus, even after being removed from the dies 21 and 22, thecore layer 13 maintains the shape obtained at the time of the pressmolding, with good accuracy.

Note that end faces of the thin plates 11 are displaced from one anotherin the end portions of the core layer 13 as in FIG. 8, but thedisplacement of the thin plates 11 is not be recognized from theoutside. This is because the frame 14 is attached to the end portions ofthe core layer 13.

In addition, at the time of the press molding, the pressure applied fromthe dies 21 and 22 causes the second surface 14 b and the third surface14 c of the frame 14 to bite into the core layer 13, so that the pressmolded component have smooth end portions. Note that in this embodiment,the lower die 21 is provided with a protrusion 21 a in a portion to bebrought into contact with the frame 14 as illustrated in a partialcross-sectional diagram of FIG. 9, and thus the first surface 14 a ofthe frame 14 is bent inward.

Next, as in a plan diagram of FIG. 10A, a panel 17 having a thickness ofapproximately 0.5 mm to 1.0 mm, for example, is prepared. Then, athermosetting adhesive 18 is applied to one of surfaces of the panel 17,as in a cross-sectional diagram of FIG. 10B. A thin plate having anaesthetically pleasing woodgrain pattern is used as the panel 17.

Next, the panel 17 is made flexible by being exposed to steam, and thenis placed on the core layer 13 in such a manner that the surface towhich the adhesive 18 is applied faces downward, as in FIG. 11. Notethat reference numeral 23 in FIG. 11 denotes an upper die for pressmolding a panel.

Next, as in FIG. 12, the upper die 23 is lowered, so that the lower die21 and the upper die 23 sandwich the core layer 13 and the panel 17.Then, a pressure and a heat are applied thereto to attach the panel 17to a surface of the core layer 13, and the adhesive 18 is hardened.Since this embodiment uses the thin plate having the thickness of 0.5 mmto 1.0 mm as the panel 17, the panel 17 is less likely to have a crackor a crease at the time of the press molding.

Note that when the panel 17 is so thin that the core layer 13 is seenthrough the panel 17, the two or more panels 17 may be stacked on oneanother. FIG. 13 is a schematic cross-sectional diagram illustrating astate where the press molded component is removed from the dies 21 and23. As in FIG. 13, the panel 17 extends downward beyond the frame 14 atthe stage after the press molding.

Next, as in FIG. 14, the panel 17 is trimmed along the frame 14 by usinga cutter, the band saw or the like. The panel 17 is supported by theframe 14 in this embodiment, and thus is less likely to have a defectsuch as pitching or the like at the time of trimming. In addition, forexample, by moving the cutter while being kept in contact with the frame14, the trimming is always performed at the same position.

An enclosure 10 according to this embodiment illustrated in FIGS. 15A to15C is completed in this manner. FIG. 15A is a top diagram of theenclosure 10, FIG. 15B is a bottom diagram thereof, and FIG. 15C is aside diagram thereof. According to this embodiment, the frame 14 iscovered with the panel 17, and thus disfigurement of the enclosure 10due to the frame 14 is prevented.

FIG. 16 is a schematic diagram illustrating a state where an electroniccomponent 25 is installed in the enclosure 10. As in FIG. 16, theelectronic component 25 is fixed onto the bosses 15 by using screws 26and is supported by the pins 16.

In this embodiment as described above, when being placed on the lowerdie 21, the core layer 13 is positioned according to the pins 16 and thenotches 13 a provided in the core layer 13. This leads to good accuracyin positioning the core layer 13 with respect to the dies 21 and 22. Byproviding the notches 13 a, occurrence of a crack or a crease at thepress molding is avoided, and thus the core layer 13 may be press moldedinto the predetermined shape.

Moreover, the adhesive 12 has not hardened at the initial stage of thepress molding in this embodiment. Thus, when being bent, the thin plates11 forming the core layer 13 are displaced from one another, and thecore layer 13 easily changes its shape in accordance with the shapes ofthe dies 21 and 22. Thereafter, the adhesive 12 hardens by being heateddue to the heat from the dies 21 and 22. Thereby, even after the corelayer 13 is removed from the dies 21 and 22, the shape of the core layer13 obtained in the press molding is maintained with good accuracy.

Further, since the panel 17 is supported by the frame 14 attached to theend portions of the core layer 13 in this embodiment, a defect such aschipping is less likely to occur when the panel 17 is trimmed foreliminating unnecessary portions.

Still further, the bosses 15 are integrally formed with the frame 14 inthis embodiment, and thus do not have to be separately formed andattached to the enclosure 10. This may reduce the number of steps. Yetfurther, since the panel 17 without notches is bonded to the core layer13 in this embodiment, the enclosure 10 has a continuous woodgrainpattern on the surface thereof, and the texture of wood is not impaired.

Hereinbelow, in comparison with Comparative Example, a description isgiven of yield results obtained by actually manufacturing enclosures bythe method of manufacturing an enclosure according the aforementionedembodiment.

EXAMPLE

Firstly, the thin plates 11 formed from thinnings and each having athickness of 0.5 mm are prepared as a material of the core layer 13.Then, a thermosetting adhesive is applied to the thin plates 11 by usinga squeeze, and then the thin plates 11 are stacked to form four layerswith their woodgrain patterns crossing each other layer by layer, sothat the core layer 13 is formed.

Next, the core layer 13 is punched by using a punch press to have theshape illustrated in FIG. 2. Thereafter, the frame 14 is attached to theend portions of the core layer 13 (see FIG. 4). The frame 14 is made ofresin, and is provided with the cylindrical bosses 15 at predeterminedpositions.

Next, the core layer 13 is made flexible by being exposed tohigh-temperature steam for about 30 seconds. Thereafter, the core layer13 is placed on the lower die 21 of the pressing machine. At this time,as in FIGS. 5A and 5B, the position of the core layer 13 is determinedby using the pins 16 as guides.

Next, the core layer 13 is sandwiched between the lower die 21 and theupper die 22, and is left for five minutes while a heat and a pressureare applied thereto. At this time, the temperatures of the lower die 21and the upper die 22 are 140° C. and 130° C., respectively, and theapplied pressure is 90 MPa.

Next, the two panels 17 each having a thickness of 0.5 mm are prepared.The thermosetting adhesive is applied to the panels 17, and the panels17 are bonded together with the woodgrain patterns thereof aligned witheach other. Then, the panel 17 thus formed into one is made flexible bybeing exposed to high-temperature steam for about 30 seconds, and islayered onto the core layer 13 by using the pressing machine.

Press molded components are obtained in this manner, and the sizes(dimensions) of each press molded component are 30 cm in length, 45 cmin width, and about 3 cm in height. A curvature radius of each cornerportion is 3 cm. Among the 50 press molded components manufactured untilthis step, the number of defectives is 2, and thus the yield is 96%.

Next, each press molded component is cut horizontally by using the bandsaw so that each enclosure 10 has a height of 25 mm. At this time, thepress molded component is cut along the frame 14. As the result, amongthe 40 press molded components, the number of press molded componentshaving pitching is 0, and the number of press molded components havingdistortion (the height changes by 2 mm or more within the same plane)is 1. In other words, the yield in the step of trimming the panel 17 is97.5%.

Comparative Example

As in Example, thin plates having the thickness of 0.5 mm are stacked onone another to have four layers, so that a core layer is formed. Then,the core layer is made flexible by being exposed to high-temperaturesteam for about 30 seconds, and then is press molded by using thepressing machine. However, unlike Example, no notches are provided inthe core layer and no frame is attached to the core layer in ComparativeExample. The press molding is performed under the same condition as inExample.

Next, two panels each having a thickness of 0.5 mm are prepared. Thethermosetting adhesive is applied to the panels, and the panels arebonded together with their woodgrain patterns aligned with each other.Then, the panel thus formed into one is made flexible by being exposedto high-temperature steam for about 30 seconds, and is layered onto thecore layer by using the pressing machine.

Press molded components are obtained in this manner, and the sizes(dimensions) of each press molded component are 30 cm in length, 45 cmin width, and about 3 cm in height. A curvature radius of each cornerportion is 3 cm. Among the 50 press molded components manufactured untilthis step, the number of defectives is 29, and thus the yield is 42%.Specifically, the number of the defectives (having at least one crack)resulting from the press molding of the core layer is 25, and the numberof the defectives resulting from the bonding of the panel is 4.

Next, each press molded component is cut horizontally by using the bandsaw so that each enclosure has a height of 25 mm. In this case, amongthe 20 press molded components, the number of press molded componentshaving pitching is 9, and the number of press molded components havingdistortion (the height changes by 2 mm or more within the same plane)is 1. The yield in the step of trimming the panel is 50%.

From Example and Comparative Example described above, it is confirmedthat this embodiment is useful.

Second Embodiment

FIGS. 17A and 17B are diagrams for explaining a method of manufacturingan enclosure according to a second embodiment. Note that differencebetween this embodiment and the first embodiment lies in that pins usedfor press molding the core layer 13 have a different shape, and theother components have basically the same configuration as that in thefirst embodiment. Hence, duplicate descriptions of the same componentsare omitted here.

In the first embodiment, before the core layer 13 is press molded, thepins 16 are inserted into the holes provided in the corner portions ofthe lower die 21, and the core layer 13 is placed on the lower die 21 byusing the pins 16 as the guides (see FIGS. 5A and 5B). In contrast inthe second embodiment, nail-shaped pins 31 each having a disc-shaped topare used as in FIG. 17A. As in FIG. 17B, the pins 31 are respectivelyplaced in the notches 13 a of the core layer 13 to which the frame 14 isattached, and the core layer 13 is placed on the lower die 21 in such amanner that tip ends of the pins 31 are inserted in holes 21 b providedin the corner portions of the lower die 21. This may make it possible toaccurately position and place the core layer 13 on the lower die 21.

The top of each pin 31 bites into the core layer 13 when the core layer13 is press molded. This makes a surface of a press molded componentflat. Accordingly, as in FIG. 18, even after the panel 17 is bonded tothe core layer 13 with the adhesive 18, the panel 17 has a flat surface.This embodiment also provides the same advantageous effects as in thefirst embodiment.

Third Embodiment

FIGS. 19 to 26C are diagrams for explaining a method of manufacturing anenclosure according to a third embodiment.

Firstly, as in a cross-sectional diagram of FIG. 19, a plurality of thinwooden plates 41 are bonded together by using a thermosetting adhesive42 to form a core layer 43. At this time, the thin plates 41 are bondedtogether by using adhesive force of the thermosetting adhesive 42 beforehardening, and thus the thermosetting adhesive 42 is not hardened.

Next, as in a plan diagram of FIG. 20, the core layer 43 is cut into apredetermined shape. At this time, notches 43 a are provided in portionsto be largely bent in press molding to be described later. It isimportant that the notches 43 a disappear by being closed at the time ofthe press molding. Portions for the notches 43 a are determined inaccordance with the shape to be obtained after the press molding.

Next, as in a cross-sectional diagram of FIG. 21A and a plan diagram ofFIG. 21B, the core layer 43 is placed at a predetermined position on alower die 51 of the pressing machine. Note that reference numeral 52 inFIG. 21A denotes an upper die for press molding a core layer.

Next, as in FIG. 22, the upper die 52 is lowered, so that the lower die51 and the upper die 52 sandwich the core layer 43. Then, a pressure anda heat are applied thereto to press mold the core layer 43 into apredetermined shape corresponding to the dies 51 and 52.

In the press molding, the notches 43 a are gradually closed as the corelayer 13 is gradually bent, and finally the notches 43 a disappear.Since the adhesive 42 among the thin plates 41 has not hardened at theinitial stage of the press molding, the thin plates 41 are displacedfrom one another when being bent. Thereafter, the adhesive 42 hardensdue to heat from the dies 51 and 52, so that the shape of the core layer43 is fixed. Thus, even after being removed from the dies 51 and 52, thecore layer 43 maintains the shape obtained in the press molding, withgood accuracy.

Next, as in FIG. 23, a panel (a thin plate having an aestheticallypleasing woodgrain pattern) 47 having a thickness of approximately 0.5mm to 1.0 mm, for example, is prepared. Then, a thermosetting adhesive48 is applied to one of surfaces of the panel 47.

Next, the panel 47 is made flexible by being exposed to high-temperaturesteam, and then is placed on the core layer 43 in such a manner that thesurface to which the adhesive 48 is applied faces downward, as in FIG.24. Note that reference numeral 53 in FIG. 24 denotes an upper die forpress molding a panel.

Next, as in FIG. 25, the upper die 53 is lowered, so that the lower die51 and the upper die 53 sandwich the core layer 43 and the panel 47.Then, a pressure and a heat are applied thereto to bond the panel 47 toa surface of the core layer 43, and the adhesive 48 is hardened.

Then, a press molded component is removed from the dies 51 and 53, andlower portions (unnecessary portions) of the press molded component aretrimmed by using the cutter or the band saw. Thereby, an enclosure 40 asillustrated in FIGS. 26A to 26C is completed. FIG. 26A is a top diagramof the enclosure 40, FIG. 26B is a bottom diagram thereof, and FIG. 26Cis a side diagram thereof.

The lower die 21 and the core layer 13 are positioned by using the pins16 (see FIGS. 5A and 5B) in the first embodiment, while no pin is usedin this embodiment. Hence, it is important that the core layer 43 bepositioned with respect to the lower die 51 with good accuracy whenbeing press molded. However, the core layer 43 is provided with thenotches 43 a in this embodiment. Thus, if the core layer 43 ispositioned with respect to the lower die 51 with good accuracy,occurrence of a crack or a crease as in the first embodiment may beavoided. Moreover, since the panel 47 without notches is bonded to thecore layer 43 also in this embodiment, the enclosure 40 has a continuouswoodgrain pattern on the surface thereof, and the texture of wood is notimpaired.

All examples and conditional language recited herein are intended forpedagogical purposes to aid the reader in understanding the inventionand the concepts contributed by the inventor to furthering the art, andare to be construed as being without limitation to such specificallyrecited examples and conditions, nor does the organization of suchexamples in the specification relate to a showing of the superiority andinferiority of the invention. Although the embodiments of the presentinventions have been described in detail, it should be understood thatthe various changes, substitutions, and alterations could be made heretowithout departing from the spirit and scope of the invention.

What is claimed is:
 1. An enclosure comprising: a core layer formed bystacking a plurality of wooden plates on one another and bent into apredetermined shape; a pin held by an end face of the core layer; and apanel covering the core layer.
 2. The enclosure according to claim 1,wherein a frame is attached to the end face of the core layer.
 3. Theenclosure according to claim 2, wherein the frame is provided with aboss for screwing.
 4. The enclosure according to claim 1, wherein thecore layer is impregnated with a flame retardant.